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datasheet product structure silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays. . 1/15 tsz02201-0f1f0c300030-1-2 15.apl.2014 rev.001 ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 14? 001 www.rohm.com ac/dc drivers ac/dc controller ic for led lighting included 650v mosfet BM520Q25F description BM520Q25F is an ac/dc converter which has a built-in mosfet with 650v withstand voltage. this ic can be applied to quasi-resonant typed high-side led driver application, an d the high current precision and low emi noise can be achieved. moreover, owing to the built-in pfc (power factor correction) converter, the harmonics can be improved. owing to the start-up circuit with 650v withstand voltage, the low power consumption is achieved. and owing to the external current setting resistance, a power supply design with a high degree of freedom can be achieved. with the built-in mosfet with 650v withstand voltage, a low-cost applicat ion can be achieved, and it makes the application design easily. key specifications ? operating power supply voltage range : vcc 8.9v to 26.0v drain: 650v ? operating current: normal operation: 0.45ma (typ.) ? operating temperature range: - 40deg. to +105deg. ? mosfet on resistance: 4.0 ? (typ.) features ? quasi-resonant switching mode + pfc circuit ? built-in 650v starter circuit ? built-in 650v switching mosfet ? maximum frequency 200khz ? vcc pin: under voltage protection ? vcc pin: over voltage protection (latch) ? source pin: leading-edge-blanking function ? led over current detection function ? zt pin: trigger mask function ? zt pin: over voltage protection (latch) ? fet over current protection function ? led current ac compensation function package sop8 5.00mm 4.40mm pitch 1.27mm (typ.) (typ.) (typ.) application led bulb, seal-typed led lighting electrical machineries for led lighting application circuit source comp gnd zt drain nc nc vcc fuse r1 f1 da1 l1 + cb c1 d1 t1 cvcc rztl rs co u1 ccomp l n led+ led- ro flt rzth figure 1. application circuit
2/15 datasheet datasheet BM520Q25F sz02201-0f1f0c300030-1-2 15.apl.2014 rev.001 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 absolute maximum ratings ta=25 item symbol rating unit condition input voltage range 1 vmax1 -0.3 30 v vcc input voltage range 2 vmax2 -0.3 6.5 v source, ntc, zt input voltage range 3 vmax3 650 v drain drain current pulse i dp 2.60 a p w =10us, duty cycle=1% maximum power dissipation p d 563 (note1) mw operating temperature range t opr -40 +105 o c maximum junction temperature tjmax 150 o c storage temperature range t str -55 +150 o c (note1) when mounted (on 70 mm 70 mm, 1.6 mm thick, gl ass epoxy on single-layer substrate). reduce to 4.563 mw/ ? c when ta = 25 ? c or above. operating conditions ta=25 item symbol rating unit condition input voltage range 1 vcc 8.9 26.0 v vcc voltage input voltage range 2 v drain 650 v drain voltage electrical characteristics ta=25 mosfet unless otherwise specified, ta = 25 ? c, vcc = 15 v item symbol specification unit condition min typ max drain-source breakdown voltage v (br)dds 650 - - v i d =1ma / v gs =0v drain leakage current i dss - - 100 ua v ds =650v / v gs =0v on resistance r ds(on) - 4 5.5 ? i d =0.25a / v gs =10v
3/15 datasheet datasheet BM520Q25F sz02201-0f1f0c300030-1-2 15.apl.2014 rev.001 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 electrical characteristics ic unless otherwise specified, ta = 25 ? c, vcc = 15 v item symbol specification unit condition min typ max circuit current circuit current (on)1 i on1 - 320 750 a source=0v (pulse operating) circuit current (on)3 i on2 - 280 400 a source=2v (pulse off) vh pin start up circuit vh starting current 1 i start1 0.20 0.55 0.90 ma vcc= 0v vh starting current 2 i start2 1 3 6 ma vcc=10v vh off current i start3 - 10 20 a vcc uvlo released vh starting current switching voltage v sc 0.3 0.7 1.6 v vcc pin vcc pin protection vcc uvlo voltage 1 v uvlo1 12.5 13.5 14.5 v vcc rising up vcc uvlo voltage 2 v uvlo2 7.5 8.2 8.9 v vcc falling down vcc uvlo hysteresis v uvlo3 - 5.3 - v v uvlo3 = v uvlo1 - v uvlo2 vcc ovp trigger voltage v ovp1 25.0 27.5 30.0 v vcc rising up vcc ovp release voltage v ovp2 21.0 23.5 26.0 v vcc falling down latch released vcc voltage v latch2 - v uvlo2 -0.5 - v vcc falling down vcc recharge start voltage v chg1 7.7 8.7 9.7 v vcc falling down vcc recharge end voltage v chg2 12 13 14 v vcc rising up latch mask time t latch 100 150 200 s [ dc/dc comparator turn-on ] zt comparator voltage 1 v zt1 60 120 180 mv zt falling down zt comparator voltage 2 v zt2 120 200 280 mv zt rising up zt comparator hysteresis v zthys - 80 - mv v zthys = v zt1 - v zt2 zt trigger mask time t ztmask - 1.2 - s vzt h->l, for preventing from noise zt trigger timeout t ztout 5 15 25 s [ dc/dc comparator turn-off ] current trigger voltage v cs 1.5 1.7 1.9 v maximum frequency f sw 180 200 220 khz leading edge blank time t leb - 0.2 - s maximum on time t max 19 39 59 s
4/15 datasheet datasheet BM520Q25F sz02201-0f1f0c300030-1-2 15.apl.2014 rev.001 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 pin configuration table 1. i/o pin functions no. pin name i/o function esd protection vcc gnd 1 vcc i/o power supply pin - 2 n.c. - non connection - - 3 n.c. - non connection - - 4 drain i/o mosfet drain pin - 5 source i mosfet source pin inductor current sensing pin - 6 comp i/o error amplifier output pin - 7 gnd i/o gnd pin - 8 zt i zero current detecting pin - i/o equivalent circuit diagram 1pin : vcc 4pin : drain 5pin : source drain(4) vcc(1) jfet gnd(7) block drain(4) source(5) vcc(1) jfet mosfet drain(4) source(5) mosfet vref4v 1m 18k 25k 6pin : comp 8pin : zt 4k 10k 10k zt(8) 50 100 10k 25k 200k 300k figure 2. i/o equivalent circuit diagram
5/15 datasheet datasheet BM520Q25F sz02201-0f1f0c300030-1-2 15.apl.2014 rev.001 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 block diagram hv starte r vcc (1) vin logic 12v clamper 200ns l.e.b. ac compenstaion 100us mask max on time s r q rs tsd vccuvlo vccrechg vccovp ocp nout 100us mask zt ovp zt comp nout startcomp max freq. po w e r su pply vccuvlo vref4v vref4v r2 r3 driver zt (8) gnd (7) 0.7v 13v/ 8.7v 13.5v/ 8.2v 27.5v/ 23.5v 3.5v 100mv/ 200mv 1m 0.6v istart1=0. 55ma istart2=3ma istart3=10ua fuse sou r ce (5) drain (4) r1 f1 cin c1 c2 c3 d3 d2 t1 cout led+ led- eamp 0.6v comp (6) osc figure 3. block diagram
6/15 datasheet datasheet BM520Q25F sz02201-0f1f0c300030-1-2 15.apl.2014 rev.001 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 0.0 ? 0.1 ? 0.2 ? 0.3 ? 0.4 ? 0.5 ? 0.6 ? 0.7 ? 0.8 ? 0.9 ? 1.0 ? 0 5 10 15 20 25 30 35 40 45 50 ?rg [sec] cvcc ? [uf] block descriptions (1) start-up circuit (drain : 4pin, vcc:1pin) (1-1)block descriptions a bootstrap circuit with 650v withstand voltage is built in this ic. owing to this, the low-power standby and high-speed start can be achieved. after the ic was booted up, the po wer consumption becomes only the idling current typ.=10ua .the reference value of the start-up time is showed in figure 7. when c vcc =10uf, the start-up time can be less than 0.1s. hv starter block vccuvlo vccrechg startcomp 0.8v 13v/ 8.7v 13.5v/ 8.2v istart1=0.7ma istart2=3ma istart3=10ua jfet on on cout drain (4) d2 led+ led- vin + fuse r1 f1 d1 cin vcc (1) t1 istart1 istart2 istart3 c1 d3 start up current [ma] figure 5. start-up circuit block diagram figure 6. start-up current vcc voltage curve the start-up current means the current from the drain pin. ex) when vac=100v, the power consumption of bootstrap circuit is pvh 100v* 2*10ua=1.41mw ex) when vac=240v, the power consumption of bootstrap circuit is pvh 240v* 2*10ua=3.38mw figure 7. start-up time vcc capacitance characteristics
7/15 datasheet datasheet BM520Q25F sz02201-0f1f0c300030-1-2 15.apl.2014 rev.001 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 (1-2)start sequences vcc supply with auxiliary winding the time chart of the start sequences are showed in figure 9. the dc/dc circuit which reduces the power consumption of the ic can be composed by using the au xiliary winding of the transformer. cout t1 vin + fuse r1 f1 d1 cin d2 led+ led- bm520q1x vcc(1) drain(4) source(5) figure 8. schematic of the dc/dc part wh ile supplying with the auxiliary winding drain (4) vcc (1) comp (6) switching i_led vuvlo1 vuvlo2 vchg1 vchg2 figure 9. on/off sequences (supplying vcc with auxiliary winding) a: input voltage vh is applied. (though t he led and the transformer, a high voltage is applied to drain pin from vh.) b: the capacitor connected to the vcc pin is char ged by the start-up current from the drain pin. c: the ic starts operating when vcc > v uvlo1 d: by the increasing of the comp pin voltage, t he ic starts up with the soft start operation. e: the current is supplied to vcc pin from the au xiliary winding by the switching operation. the power is supplied by the auxiliary winding, and the vcc voltage is determined by the s pecification of transformer. f: when the power supply turns off, vcc voltage falls down due to the descend of the voltage of drain pin. the ic turns off when the v uvlo2 is triggered. a b c d e f g h i 25
8/15 datasheet datasheet BM520Q25F sz02201-0f1f0c300030-1-2 15.apl.2014 rev.001 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 (2) vcc pin protection function the vcc under voltage protection function vcc uvlo (under voltage lock out), over voltage protection function vcc ovp (over voltage protection), and a vcc recharge function which operates when a voltage dr op occurs at vcc pin are built in this ic. the vcc uvlo and vcc ovp functions are used for preventing the destructions of the switching mosfet which occurs when the vcc voltage is too high or too low. owing to the vcc charge function, the vcc pin is charged from high voltage lines by the start circuit when the vcc voltage drops, and the secondary output voltage is stabilized. ( 2-1) vcc uvlo / vcc ovp function vcc uvlo and vcc ovp are auto recovery co mparators which have voltage hysteresis. vcc ovp has a built-in mask time t latch typ.=150us. when the vcc voltage is over v ovp typ.=27.5v ,and this state lasts t latch typ.=150us , the detection is executed. by this function, the surge which occurs at vcc pin can be masked . (2-2) vcc charge function when the vcc pin voltage is over v uvlo1 , the ic starts up. in this case, if the vcc pin voltage drops below v chg1 , vcc charge function operates. at this time, the vcc pin is charged from t he drain pin through the bootstrap circuit. owing to this operati on, the failure of start-up can be prevented. a: drain pin voltage is applied, vcc voltage rises by the charging current istart1 (typ.=550ua). b: vcc voltage> v sc , the charging current to vcc changes from istart1(typ.=550ua) to istart2(typ.=3ma) c: vcc voltage> v chg2 , though vcc charge function reacts, due to vcc uv lo is detected, the charge continues. d: vcc voltage> v uvlo1 , the vcc uvlo is released, and dc/dc oper ation starts, the charge to vcc stops. e: vcc voltage> v chg1 , the charge to vcc restarts. f: vcc voltage> v ovp1 , vcc ovp is detected. g: vcc voltage> v ovp2 , if vcc voltage drops below v ovp2 in 150us, vcc ovp is released, and the latch will not be activated. h: v ovp2 < vcc voltage < v ovp1, if this state is kept longer than 150us, the switching stops by latch. i: vcc voltage< v uvlo1, vcc uvlo is detected. j: vcc voltage< v latch , the latch state is released. k: vcc voltage< v sc , the charging current to vcc changes from start2(typ.=3ma) ? istart1(typ.=550ua) figure 10. vcc uvlo/ vcc ovp / vcc charge function timing chart
9/15 datasheet datasheet BM520Q25F sz02201-0f1f0c300030-1-2 15.apl.2014 rev.001 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 (3) l.e.b blanking period when the mosfet driver is turned on, surge current occurs by the capacitive components and driv e current. in this case, if the source pin voltage rises temporarily, false detections may occur in the over current limiter circuit. for preventing from t he false detections, a l.e.b function leading edge blanking function which masks the source volta ge during the 200nsec after the out pin switches form l h is built in. ( 4) source pin open protection when the source pin (pin 5) becomes open, the ic may be damaged by overheats. for preventing from this, an open protection circuit is built in this ic. (automatic recovery protection) ( 5)error amplifier block (comp : 6pin) an error amplifier is built in this ic, t he gate on time of the built-in mosfet is changed by controlling t he output of the err or amplifier. the voltage which occurs on the cu rrent sensing resistor rs becomes the input voltage of the error amplifier, the su m of the current which flows through the indu ctor while the mosfet is on, and the current which flows through the flyback diode while the mosfet is off (led current) flows through the rs. + - + - comp eamp source(5) comp(6) drain(4) ton control rs c3 0.8v figure 11. diagram of error amplifier block the on time of the mosfet which is decided by the voltage of comp pin is as showed in figure 12. figure 12. comp voltage ?ton time
10/15 datasheet datasheet BM520Q25F sz02201-0f1f0c300030-1-2 15.apl.2014 rev.001 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 operation mode of protection circuit operation mode of protection f unctions are shown in table 2. table 2. operation mode of protection circuit abnormal state detection detect release protection operations vcc uvlo <= 8.2v >= 13.5v automatic recovery ovp >= 27.5v before latch <= 23.5v latched vcc<= 7.7v 100us timer latch tsd >= 175 before latch <= 155 latched vcc<= 7.7v 100us timer latch sequences the sequences diagram of all states of this ic is showed in figure 13. in all states, when vcc<8.2v, t he states change to off mode. figure 13. transition diagram of all states
11/15 datasheet datasheet BM520Q25F sz02201-0f1f0c300030-1-2 15.apl.2014 rev.001 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 thermal loss according to the thermal design, please observe the conditions below when use this ic. 1. the ambient temperature ta must be 105 or less. 2. the consumption of the ic mu st be within the allowable dissipation p d . the thermal dissipation characteristics are as follows. (pcb: 70 mm 70mm 1.6 mm, mounted on glass epoxy substrate) 0 100 200 300 400 500 600 700 800 900 1000 0 25 50 75 100 125 150 pd[mw] ta[ ] figure 14. thermal dissipation characteristics
12/15 datasheet datasheet BM520Q25F sz02201-0f1f0c300030-1-2 15.apl.2014 rev.001 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply terminals. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital bloc k from affecting the analog block. furthermore, connect a capacitor to ground at all powe r supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors . 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the refe rence point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground trac es of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properties of the ch ip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epox y board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the ex pected characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consi deration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always dischar ge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pc b. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.
13/15 datasheet datasheet BM520Q25F sz02201-0f1f0c300030-1-2 15.apl.2014 rev.001 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 operational notes ? continued 11. unused input terminals input terminals of an ic are often connec ted to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electr ic field from the outside can easily charge it. the small charge acquired in this way is enough to produce a signifi cant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input terminals should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrat e layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic . the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the c hange of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that the output voltage, output curren t, and power dissipation are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that pr events heat damage to the ic. normal operation should always be within the ic?s power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circui t that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are autom atically restored to normal operation. note that the tsd circuit operates in a situation that exceed s the absolute maximum rati ngs and therefore, under no circumstances, should the tsd circuit be used in a set desi gn or for any purpose other t han protecting the ic from heat damage. 16. over current protection circuit (ocp) this ic incorporates an integrated overcu rrent protection circuit that is acti vated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous operation or transitioning of the protection circuit.
14/15 datasheet datasheet BM520Q25F sz02201-0f1f0c300030-1-2 15.apl.2014 rev.001 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 physical dimension, tape and reel information package name sop8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (unit : mm) pkg : sop8 drawing no. : ex112-5001-1 (max 5.35 (include.burr))
15/15 datasheet datasheet BM520Q25F sz02201-0f1f0c300030-1-2 15.apl.2014 rev.001 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 ordering information b m 5 2 0 q 2 5 f -xx product name package f : sop8 packaging and forming specification xx: please confirm the formal name with our salesmen. marking diagram lot no. 1pin mark 20q25
datasheet datasheet notice ? ge rev.002 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class classb class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet datasheet notice ? ge rev.002 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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